Facility Overview
2,600㎡ modern industrial plant located in Dongguan, Guangdong, China.
Production Infrastructure
Comprehensive In-House Manufacturing Capabilities
Dongguan Cevra Electronic Technology Co., Ltd. operates integrated workshops encompassing precision silk-screen printing, CNC laser processing, automated lamination, cleanroom assembly, and reliability testing.
Production Floor
Spacious, streamlined manufacturing floor configured for lean component flow.
Clean Workshop
Temperature- and dust-controlled environment for optical window laminations.
Material Storage
Classified inventory of Autotype PET, Lexan PC, 3M adhesives, and stainless domes.
Precision Equipment
Advanced Production Machinery & Processing Lines
Each manufacturing stage utilizes automated and semi-automated machinery to deliver micron-level layer alignment, consistent conductive silver traces, and durable graphic overlays.
Printing Phase
Precision Printing Line
Dedicated semi-automatic and automated silk-screen printing lines for graphic overlays, conductive silver circuits, carbon ink pads, and dielectric isolation masks.
- Substrates Handled: PET / Polycarbonate / FPC
- Ink Curing: Tunnel Oven & UV Systems
Artwork & Color
Color Matching & Screen Printing
Accurate Pantone and RAL matching for membrane faceplates with tight color density consistency across repeat mass-production batches.
- Color Precision: Pantone / RAL matched
- Surface Options: Glossy, Textured, Selective Anti-Glare
Alignment Tech
CCD Drilling Machine
Equipped with optical vision alignment to drill precise fiducial target holes, ensuring registration tolerance within ±0.05 mm across multi-layer membrane stacks.
- Positioning Accuracy: ±0.05 mm
- Target Tracking: High-resolution optical camera
Toolless Cutting
Laser Cutting Machine
High-speed CO2 laser cutting system utilized for rapid prototyping, toolless custom shapes, intricate spacer venting channels, and adhesive die-cuts.
- Cutting Precision: ±0.1 mm
- Advantage: Zero tooling fee for prototypes
Mass Forming
Precision Punching Machine
Heavy-duty hydraulic and mechanical punch presses fitted with hardened steel dies for key embossing (rim, pillow, polydome) and perimeter profiling.
- Embossing Styles: Flat, Rim, Pillow, Dome
- Capacity: High-speed serial die punching
Lamination
Fully Automatic Laminating Machine
Multi-roller automated laminators deliver uniform pressure and temperature control, preventing air entrapment, silver oxidation, and adhesive bubbles.
- Bonding Media: 3M 467MP, 468MP, 300LSE, Crown
- Bubble Control: Zero-defect optical clarity
Automation
Automatic Assembly Machine
Specialized pick-and-place equipment for precise high-speed placement of 4-leg, round, and triangular metal domes onto carrier adhesive arrays.
- Domes Supported: 4-leg, round, oblong, triangular
- Yield Rate: > 99.8% accurate placement
Flexible Sensor
Thin-Film Laser Profiling
Burr-free clean edge cutting for capacitive touch foil, flexible sensor film circuits, and custom connector tail geometries.
- Edge Quality: Burr-free, smooth edge finish
- Material Thickness: 0.05 mm - 1.5 mm
Protection
Standard Export Packaging
Strict anti-static shielding bags, desiccants, protective peel-off film on overlays, and reinforced corrugated export cartons to safeguard long-haul sea/air shipments.
- Standard: ESD Protective & Moisture-sealed
- Traceability: Custom batch barcode labeling
Reliability & Verification
In-House Quality Control & Testing Laboratory
Reliability is critical for medical, industrial, and aerospace control interfaces. Dongguan Cevra Electronic Technology Co., Ltd. conducts comprehensive physical, electrical, and environmental testing on every production batch.
CCD Vision Inspection
Automated optical inspection scanning for pinholes, open circuits, short circuits, registration errors, and graphic printing blemishes.
100% Electrical Function Testing
Microcomputer test fixtures verify loop contact resistance, open circuit resistance (>10MΩ @ 100V DC), key bounce, and LED polarity for every unit before packing.
Metal Dome Actuation Load Tester
Measures peak trip force, return force, travel distance, and tactile snap ratio (typically >45%) to guarantee uniform tactile response across keys.
High & Low Temperature Cabinet
Thermal testing from -40°C to +85°C and 95% RH humidity simulation to ensure no delamination, resistance drift, or graphic warping under harsh environments.
Adhesive 180° Peel Tension Tester
Measures adhesive bonding strength between graphic overlay, spacer, circuit, and housing substrate to prevent edge lifting over prolonged service life.
Holding Tack & Shear Tester
Static load testing of pressure-sensitive adhesive tapes to verify shear resistance and long-term bonding endurance under sustained mechanical stress.
Electric Pencil Hardness Tester
Evaluates surface scratch resistance (typically 2H to 3H on hardcoated PET/PC materials) according to ASTM D3363 international standards.
2.5D Optical Dimension Instrument
Non-contact coordinate measurement equipment ensuring connector tail pitch, outline dimensions, and window apertures match engineering drawings to ±0.02 mm.
Final QC Cosmetic & Tactile Audit
Manual tactile feel audit combined with 100% cosmetic inspection under standardized D65 lighting to eliminate scratches, bubbles, or dust particles.
Front-End R&D Support
Engineering Review & Rapid DFM Turnaround
Successful membrane keypad production starts with rigorous engineering analysis. Our design team reviews customer drawings in CAD, DXF, PDF, and AI formats to optimize circuit layouts, conductor pitch, tactile feedback, and sealing channels.
Design for Manufacturability (DFM)
Thorough evaluation of track spacing, bend radii, tail exits, and LED window clarity before tooling starts.
Fast Prototyping Support
Direct digital plotting and laser cutting capabilities allow sample delivery within 5-7 working days.
Complete Layer Stack-Up Customization
Tailored selections of graphic films, spacer adhesives, dome retainers, shielding layers, and backer plates.
